1. Intelligent heating, fan untrasfer,heating is not powered on.
2. Instrument control,and three independent heating zone,suitable for lead-free process.
3. The first heating zone, the second heating zone heater uses finely heating material,produces the high temperature breeze, the third heating zone uses the far infrared to send the hot plate preheating,prevents the PCB board curve.
4. 8 steps temperature control, that simulates the effect of reflow soldering machine. You can store 10 sets of temperature and time parameter.
5. After the heating finished used the great current capacity constant flow antithetical PCB board to carry on cooling,prevented the PCB board to curve,guarantee welding effect.
6. Hand-held vauum wand sucking BGA, convenient,reliable,durable.
7. Card board with a special tooling for a wide variety of notebook motherboard.
8. Hot air with a variety of dimensions,or according to special nozzle require custom.

 

Main Technical Parameters:

 

MODEL	HK280
Solder Type	Normal Solder/Lead free
SMD	µBGA、BGA、CSP、QFP etc
PCB Thickness	0.5～4mm
PCB  PCB Size	MAX 380mmW*420mmL
Heating/Consumption(Upper)	Hot flow /800W
Heating/Consumption(Bottom)	IR/3000W  +  Hot flow/800W
Heating Areas	6 areas
Bottom heating moves  Z axis	YES
Positionging PCB	outer, jig
Driver	Gear、rack
Moveing	Manual
Control	Instrument
Max Consumption	4.7KW
Power	1￠，220V   OR  3￠，380V OR 110V
Dimension	600mmL X 550mmW X 600mmH
Weight	33Kg